COOLER CORES, SMARTER SYSTEMS

The SilverStone TF01 delivers high thermal conductivity that bridges the gap between your CPU and cooler with maximum efficiency. It’s the unsung hero behind lower temps and longer hardware life.

PRECISION COOLING IN A TINY TUBE

Don’t let its size fool you—the TF01 is engineered for high-performance PCs where every degree counts. Its optimized formula ensures even spread, easy application, and powerful cooling with no electrical conductivity.

TURN DOWN THE HEAT. CRANK UP THE POWER

Whether you're gaming, overclocking, or simply demanding more from your build, the TF01 helps you maintain stable performance under pressure—reducing thermal resistance for peak operational efficiency.

THERMAL PASTE THAT PERFORMS UNDER FIRE

When the system heats up, TF01 steps in. With a compound crafted for excellent heat transfer, it’s ideal for CPUs, GPUs, and any heatsink in need of a serious thermal handshake.

LONG-LASTING, NON-CURING RELIABILITY

SilverStone TF01 is made to last. Its non-curing, non-bleeding compound keeps working long after others dry out—delivering reliable cooling with no need for reapplication anytime soon.

THE FINAL TOUCH FOR FLAWLESS BUILDS

Every serious system needs serious thermal paste. TF01 finishes your setup with the cooling finesse it deserves—making it the go-to solution for builders who demand nothing less than optimal performance.

Specifications

Model No	Silver Stone TF01 Thermal Paste
Part No	SST-TF01
Capacity	2g
Thermal conductivity	> 6.5 (W/m-k)
Temperature Resistance	-50 ~ 340℃
Operating temperature	-30 ~ 280℃
Specific Weight	> 3.25 (g/cm3)(25℃)
Special Features	Ultra high thermal conductivity Will not separate, migrate or bleed Widely applicable to different hardware components (CPU, GPU, chips…etc)
Dimension	119mm x 20mm
Warranty	1 Year ( As per Manufacturer Policy )

Reviews

Silver Stone TF01 Thermal Paste With High Thermal Conductivity

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